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Specifications
| Product Model | DHI-SSD-C900VN1TB |
| Capacity | 1 TB |
| Form Factor | M.2 2280 |
| Port | PCIe Gen 3.0 x 4 |
| Net Weight | Max. 8 g (0.02 lb) |
| Product Dimensions 2 |
80.00 mm × 23.00 mm × 4.80 mm (3.15″ × 0.91″ × 0.19″) |
| Packaging Dimensions |
140.5 mm × 105.5 mm × 15.50 mm (5.53″ × 4.15″ × 0.61″) |
| Memory Component | 3D TLC |
| Power Consumption 3 | 4.10 W (max); 0.611 W (idle) |
| S.M.A.R.T | Yes |
| TRIM | Yes |
| Garbage Collection | Yes |
| Sequential Read 3 | Up to 3,400MB/s |
| Sequential Write 3 | Up to 3,000MB/s |
| 4K Random Read 3 | Up to 360,000 |
| 4K Random Write 3 | Up to 280,000 |
| MTBF | 1,500,000 hours |
| Operating Temperature |
0 °C to +70 °C (+32 °F to +158 °F) |
| Storage Temperature |
–40 °C to +85 °C (–40 °F to +185 °F) |
| Operating Humidity | 5%–95% (non-condensing) |
| Vibration Resistance | 7-800 Hz, 3.08 G |
| Shock Resistance | 1,500 G/0.5 ms (half sine wave) |
| TBW | 512 TB |
Features
- Adopts high-quality 3D NAND wafer level chip
- Supports PCIe3.0 x4 and NVMe 1.3 protocol
- All-metal cooling plate is included; equipped with intelligent temperature control technology
- Adopts TRIM to improve read/write performance and speed
- Supports Max. Write technology for full-disk SLC cache
- Supports LDPC ECC to enhance data reliability
- Low power consumption management
| Weight | 5 kg |
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