Specifications
| Product Model | DHI-SSD-E900N1TB |
| Capacity | 1 TB |
| Form Factor | M.2 2280 |
| Port | PCIe Gen 3.0 x 4 |
| Net Weight | Max 8 g (0.02 lb) |
| Product Dimensions 2 |
80.0 mm × 23.0 mm × 4.8 mm (3.15″ × 0.91″ × 0.19″) |
| Packaging Dimensions |
140.5 mm × 105.5 mm × 15.5 mm (5.53″ × 4.15″ × 0.61″) |
| Memory Component | 3D NAND |
| Power Consumption 2 |
3696 mW (max) 1188 mW (idle) |
| S.M.A.R.T | Support |
| TRIM | Support |
| Garbage Collection | Support |
| Sequential Read 3 | Up to 2000 MB/s |
| Sequential Write 3 | Up to 1600 MB/s |
| 4K Random Read 3 | Up to 230000 |
| 4K Random Write 3 | Up to 230000 |
| MTBF | 1,500,000 hours |
| Operating Temperature |
0°C to +70°C (+32°F to +158°F) |
| Storage Temperature |
–40°C to +85°C (–40°F to +185°F) |
| Operating Humidity | 5%–95% (non-condensing) |
| Vibration Resistance | 10–200 Hz, 0.5 G |
| Shock Resistance | 1500 G/0.5 ms (half sine wave) |
| TBW | 512 TB |
Features
- Adopts high-quality 3D NAND wafer level chip
- Supports PCIe3.0 x4, and NVMe 1.3 protocol
- All-metal cooling plate is included; equipped with intelligent temperature control technology
- Supports TRIM to improve read/write performance and speed
- Supports Max. Write technology for full-disk SLC cache
- Supports LDPC ECC
- Low power consumption management
| Weight | 5 kg |
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